HPC MSU

Publications of the HPC²

Publications by HPC centers and institutes include items from past years such as an early publication written by one of the HPC founding investigators, Dr. Joe Thompson. Numerical Grid Generation was originally published by Elsevier Science Publishing Co., Inc. in 1985, and the copyright was transferred to Joe F. Thompson in 1997.

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Publications for: King
Peer-Reviewed Journals
Weed, B. C., Bova, T. L., Patnaik, S. S., Brazile, B., Mochal-King, C., Rude, B., Prabhu, R., Williams, Lakiesha N., & Liao, J. (2014). 3D Printing Assisted Rapid Prototyping and Optimization: Development of a Novel Small Intestinal Cannula for Equine Research. 3D Printing and Additive Manufacturing. 140 Huguenot Street, 3rd Floor New Rochelle, NY 10801-5215. USA: Mar Ann Liebert Publications. 1(2), 104-106. DOI:10.1089/3dp.2013.0008.

Oedekoven, C. S., Buckland, S. T., MacKenzie, M. L., King, R., Evans, K. O., & Burger, L. W. (2014). Bayesian Methods for Hierarchical Distance Sampling Models. Journal of Agricultural, Biological, and Environmental Statistics. International Biometric Society. 19(2), 219-239. DOI:10.1007/s13253-014-0167-0. [Abstract] [Document]

Peer-Reviewed Conference Papers
AbuOmar, O., Nouranian, S., King, R., Ricks, T., & Lacy, T. (2014). Mechanical Property Classification of Vapor-Grown Carbon Nanofiber/Vinyl Ester Nanocomposites Using Support Vector Machines. The 10th International Conference on Data Mining, July 21-24, 2014. Las Vegas, NV, USA. [Document] [Document Site]

AbuOmar, O., Nouranian, S., King, R., & Lacy, T. (2014). On Materials Informatics and Knowledge Discovery: Mechanical Characterization of Vapor-Grown Carbon Nanofiber/ Vinyl Ester Nanocomposites. Shechtman International Symposium, June 29- July 04, 2014. Cancun, Mexico. [Document] [Document Site]

M. Al Boni, AbuOmar, O., & King, R. (2014). ReShare: An Operational Ontology Framework for Research Modeling, Combining and Sharing. Computational Science and Computational Intelligence (CSCI), 2014 International Conference on, Vol 1. Las Vegas, NV, USA: IEEE. 1, 327 - 333. DOI:10.1109/CSCI.2014.63. [Abstract] [Document] [Document Site]